The function of the hard and high-temperature filler metals described is based on their ability when in the molten state to dissolve elements of the materials to be joined, thus creating a strong metallurgical bond similar to a welded joint. In contrast to welding, however, the base materials do not melt because the melting ranges of the solder alloys are much lower than those of the base materials.
The fact that the joining process is carried out in a vacuum atmosphere prevents any interaction between the solder and base materials with the surrounding atmosphere. This means that the use of highly-corrosive fluxes can be avoided on the one hand, while the vacuum atmosphere in the joining process means that the physical properties of the base materials are not influenced on the other.
Individual factors such as the pressing force and the holding time at working temperature can vary strongly from material to material and therefore require comprehensive metallurgic expertise when it comes to deriving the appropriate process parameters. Get in touch with us, and we can advise you in detail and identify the process that’s right for you in our Innovation Lab.
The diffusion bonding system still offers the possibility of performing conventional vacuum brazing supported by pressing force. In this process, the pressing forces required are significantly lower than in diffusion bonding with the aim of minimizing component distortion as a consequence of the release of tension. Brazing supported by pressing force also enables vacuum brazing of large material joints, which could not be joined with sufficient reliability using conventional vacuum brazing.