Mold making:
In the production of injection molds, diffusion bonding opens up new design and strength possibilities. The optimized method of mold cooling leads to shorter cycle times for injection molding equipment.
Semiconductor industry:
In components for photolithographic structuring and thin-film production equipment, the joints meet the highest demands for corrosion resistance and long service life. Downtimes due to failures can be reduced to a minimum. In addition, there are no undesirable elements in the joining zone that could cause contamination of the equipment. In addition to high-quality steel joints, aluminum and its alloys can also be welded.
Energy technology:
Diffusion-welded heat exchangers made of steels or nickel-based alloys are manufactured for extreme process temperatures and pressures (-200 -600°C and pressures up to 1000bar) due to the joint strength. These heat exchangers, known as PCHEs, are mainly used in gas liquefaction and at hydrogen tapping points.
In the field of electromobility, copper or aluminum components are increasingly used for thermal management and electrical contacting, which often pose a challenge in terms of joining technology Flat copper and/or aluminum welds are predestined for diffusion bonding.
PVA TePla AG uses its many years of expertise to develop diffusion bonding systems whose pressing principle allows high pressures to be generated homogeneously over a very large area (up to 1.5 m²).
With its many years of experience, the sister company PVA Industrial Vacuum Systems ensures precisely fitting and efficient furnaces. Vacuum Processing Service - in cooperation with research institutes - is particularly involved in the development, design and optimization of diffusion bonding processes.
The ”Günther Köhler Institute for Joining Technology and Materials Testing” (ifw) in Jena has been a reliable partner for many years.